https://www.avient.com/resources/safety-data-sheets?page=7171
GREEN BASE POST CC2862 KUMHO UV ABS V3
https://www.avient.com/resources/safety-data-sheets?page=2841
PX-V-202 021C ORNGE M3122-BASE 50A TRANS
https://www.avient.com/resources/safety-data-sheets?page=4659
STAN-TONE HCC- COPPER BASE
https://www.avient.com/resource-center?document_subtype=127&document_type=59&form_build_id=form-Ojq3VtEkRrXIsgZSyKvAgO_Z3JHuKtjJLR7xfOXoAI8&form_id=resource_filter_form&industry=0&op=FILTER RESULTS&product_family=81&product_name=0&product_subfamily=0&page=2
Maxxam™ FR Formulation provided flame retardent and HDPE based solution for power tool battery pack
https://www.avient.com/resource-center?document_subtype=0&document_type=59&form_id=resource_filter_form&industry=0&op=FILTER RESULTS&product_family=0&product_name=0&page=41
Gravi-Tech™ polymer-metal composites are high density materials developed as thermoplastic-based alternatives to lead and other traditional metals
https://www.avient.com/resource-center?document_type=59&page=42
GLS Thermoplastic Elastomer based impact modifier used to increase stiffness, lower weight and reduce cost for a storage tote
https://www.avient.com/resource-center?document_type=59&page=35
Key properties, rheology and property retention and performance data for reSound™ TPEs derived from plant-based sugar for overmolding onto PP and ABS
https://www.avient.com/resource-center?document_type=59&document_subtype=117&page=1
GLS Thermoplastic Elastomer based impact modifier used to increase stiffness, lower weight and reduce cost for a storage tote
https://www.avient.com/resource-center?document_type=59&document_subtype=0&industry=0&product_family=0&product_name=0&op=FILTER RESULTS&form_id=resource_filter_form&page=45
Explore our range of specialty screen printing inks, including: non-phthalate PVC plastisol, water-based, silicone, and non-PVC plastisol
https://www.avient.com/idea/navigating-challenges-semiconductor-packaging-specialty-polymer-solutions
Increased Demand for Specialty Polymer Solutions and Materials for Semiconductor Packaging
The demand for data center infrastructure has significantly increased with the accelerated adoption of AI-based solutions, cloud computing, and big data analytics.
