These materials are typically opaque, with a sharp melting point, have good strength, excellent wear performance, and good chemical resistance. Mold Filling Simulation Simulates how melted plastic flows during the injection molding process to validate part design & material solution. Contact us today to learn more.

PHYSICAL/CHEMICAL PROPERTIES CATEGORY DETAIL EC Number 236-675-5 CAS Number 13463-67-7 Name Subclass 1 Titanium Dioxide (TiO2) Structural Formula O======Ti====== O PROPERTY DETAIL Physical State Solid Form Crystalline Color White Odor Odorless Melting Point 1560–1843°C Boiling Point 3,000°C Bulk Density 3.9 g/mL at 25°C Water Solubility Immiscible HEALTH EFFECTS HUMAN HEALTH SAFETY ASSESSMENT Consumer Based on available data, TiO2 is not a hazardous substance. The substance is used in powdered form in industrial settings only. COMPANY CONTACT INFORMATION corporateregulatory@avient.com ENVIRONMENTAL EFFECTS The substance is a natural mineral.

The point where conductivity begins is called the “percolation threshold.” Unlike chopped glass fibers, is a fine powder used to thicken resin. Copper filler, often in powder or flake form, is also a good substitute for aluminum, as it has a much higher melting point and doesn’t corrode like aluminum will.

The point where conductivity begins is called the “percolation threshold.” Unlike chopped glass fibers, is a fine powder used to thicken resin. Copper filler, often in powder or flake form, is also a good substitute for aluminum, as it has a much higher melting point and doesn’t corrode like aluminum will.

The point where conductivity begins is called the “percolation threshold.” Unlike chopped glass fibers, is a fine powder used to thicken resin. Copper filler, often in powder or flake form, is also a good substitute for aluminum, as it has a much higher melting point and doesn’t corrode like aluminum will.

The point where conductivity begins is called the “percolation threshold.” Unlike chopped glass fibers, is a fine powder used to thicken resin. Copper filler, often in powder or flake form, is also a good substitute for aluminum, as it has a much higher melting point and doesn’t corrode like aluminum will.

The point where conductivity begins is called the “percolation threshold.” Unlike chopped glass fibers, is a fine powder used to thicken resin. Copper filler, often in powder or flake form, is also a good substitute for aluminum, as it has a much higher melting point and doesn’t corrode like aluminum will.

The point where conductivity begins is called the “percolation threshold.” Unlike chopped glass fibers, is a fine powder used to thicken resin. Copper filler, often in powder or flake form, is also a good substitute for aluminum, as it has a much higher melting point and doesn’t corrode like aluminum will.

The point where conductivity begins is called the “percolation threshold.” Unlike chopped glass fibers, is a fine powder used to thicken resin. Copper filler, often in powder or flake form, is also a good substitute for aluminum, as it has a much higher melting point and doesn’t corrode like aluminum will.

Typical drying conditions are 3 hours at 130 - 150°F and a -40°F dew point. Melt Temperature    Substrate Type - additives (glass-filled, mineral-filled, heat-stabilized, lubricated)