https://www.avient.com/sites/default/files/resources/Novel_Thermoplastic_Elastomers_with_Universal_Bonding_Characteristics.pdf
The substrates materials
employed for overmolding were PP, ABS, PC/ABS, polyester, Nylon and POM.
Each formulation was
designed to selectively bond to a substrate based on the functionality of the substrate material.
The bonding characteristics of TPE-2 materials to all the substrates
were adhesive in nature.
https://www.avient.com/sites/default/files/2021-09/versaflex-ce-tpes-for-5g-application-bulletin-cn.pdf
Versaflex CE TPEs for 5G Application Bulletin_CN8.26-2
VERSAFLEX™ CE TPEs 实现 5G 信号高速传输
应用公告
主要特性
为实现信号高速传输和连接提供卓越的介电性
能及较低的信号损耗
与标准 TPEs 相比,具有更低的介电常数(Dk)
和介电损耗(Df)
物理性能优越、耐紫外线、美观
行业&应用
Versaflex™ CE 3140 TPEs 专为手机保护壳研制,
最大限度地减少信号损耗,实现 5G场景中终端设
备的高速连接,为消费者提供无缝使用体验。
分类 Dk @ 40 GHz Df @ 40 GHz
Versaflex CE 3140-65N 2.49 0.024
Versaflex CE 3140-90N 2.54 0.021
标准TPE (70A) 2.67 0.055
标准TPE (90A) 2.83 0.038
5G信号通透性能
*兼容5G手机壳的行业基准:2.5 Dk @ 37 GHz
特性 VERSAFLEX CE 3140 标准 TPE
5G毫米波 (mmWave) 频率下的性能 优异 一般
目标介电常数 (
https://www.avient.com/sites/default/files/resources/Universal_Polyamide_Overmold_Thermoplastic_Elastomer.pdf
The TPE family
has adhesion on any type of polyamide tested in the study, including undried materials, making
them truly Universal polyamide overmold TPEs.
Novel developments in thermoplastic elastomers
have been driven by application demands that far exceed the TPE chemistry material selection
Page 1 of 11
space illustrated in this figure.
The current
paper offers a novel robust TPE material selection for overmolding on to Polyamide.
https://www.avient.com/sites/default/files/resources/TPE_Overmolding_Solutions_for_Engineering_Thermoplastics.pdf
This is especially true
for long, thin parts or parts where the substrate is thinner than the over-mold or if
a low modulus substrate material is used.
This can be partially counteracted by
using higher modulus substrate materials and providing stiffening ribs in the
substrate.
Provide a spring-loaded area if the inserted substrate is metal or other non-
compressible material.
https://www.avient.com/knowledge-base/article/overmolding-mold-design?rtype[]=1164
If a reinforced substrate material is used a high hardness abrasion resistant steel may be required.
Part dimensions including substrate warpage.
Back gating through a pin and hole in substrate
https://www.avient.com/idea/considerations-when-printing-and-marking-fluoropolymers
Fluoropolymers typically have non-stick properties that make it difficult for ink to adhere to the substrate.
When the material is cured properly, the print will melt into the top layer of the surface of an application.
The use of the same matrix material creates a uniformly melted top layer.
https://www.avient.com/industries/healthcare/medical-devices-equipment/surgical-medical-instruments
Understand the material compatibility with common disinfectants of various materials used in healthcare applications
Catheter Materials & Medical Tubing
5G Applications
https://www.avient.com/knowledge-base/article/apparent-hardness-vs-thickness-overmold-applications
Hardness is defined as a materials’ resistance to indenture.
For over-mold applications, the thinner the elastomer is on the substrate, the harder it will feel.
One of the controlling factors for relative hardness is a function of both the substrate and the TPE thickness.
https://www.avient.com/knowledge-base/article/apparent-hardness-vs-thickness-overmold-applications?rtype[]=1164
Hardness is defined as a materials’ resistance to indenture.
For over-mold applications, the thinner the elastomer is on the substrate, the harder it will feel.
One of the controlling factors for relative hardness is a function of both the substrate and the TPE thickness.
https://www.avient.com/sites/default/files/2020-10/tpe-overmold-design-guide.pdf
If a reinforced substrate material is used,
high hardness abrasion resistant steel will be required.
Reduce melt temperature (injection speed).
• Change substrate material
Reduce melt temperature (injection speed).
• Change substrate material