https://www.avient.com/products/fiber-line-engineered-fiber-solutions
High Performance Synthetic Fibers
Ultra-High Molecular Weight Polyethylene
High Performance Synthetic Fibers
https://www.avient.com/sites/default/files/2020-08/edgetek-3d-lds-product-bulletin.pdf
The material solutions offer high
design flexibility, multi-function integration, size
miniaturization and weight reduction to meet
demanding manufacturing requirements without
compromising production efficiency and cost.
The 3D/LDS Edgetek formulations help advanced
electronic component manufacturers to miniaturize
mechanical and electrical systems for smaller
end products, even in high heat manufacturing
process, such as Surface-Mounted Technology
(SMT), and are commonly used in industries like
electronics, automotive and the 5G sector and
related infrastructure.
You have the responsibility to conduct full-scale end-product performance testing
to determine suitability in your application, and you assume all risk and liability arising from your use of the information and/or use or handling of any product.
https://www.avient.com/products/fiber-line-engineered-fiber-solutions/high-performance-synthetic-fibers/vectran-liquid-crystal-polymer
High Strength and Flex Fatigue
High abrasion resistance
High Modulus
https://www.avient.com/resource-center?document_type=0&form_build_id=form-fNS88LG3BRw1MCsEhxqrGzoCcCISeOxlsDfIOUV4Mx0&form_id=resource_filter_form&industry=0&op=FILTER RESULTS&product_family=84&product_name=0&product_subfamily=0&page=4
Learn about colorful options for high temperature polymers
High-temperature colorants for polyetherimide resin
High-temperature colorants for polyphenylsulfone resin
https://www.avient.com/sites/default/files/2020-09/stat-tech-tri-fold-processing-guide.pdf
Stat-Tech™
STATIC DISSIPATIVE &
ELECTRICALLY CONDUCTIVE
FORMULATIONS
PROCESSING GUIDE
Stat-Tech™
Stat-Tech™ Static Dissipative and Electrically Conductive Formulations are specifically engineered to provide antistatic, ESD
and EMI/RFI shielding performance for critical electronic equipment applications.
These materials combine the performance
of select engineering resins with reinforcing additives, such as carbon powder, carbon fiber, nickel-coated carbon fiber and
stainless steel fiber, for low-to-high levels of conductivity depending upon application requirements.
Conductive properties are achieved with a silver or fibrous surface appearance.
https://www.avient.com/news/archives?page=28
Avient Expands High-Performance Materials Portfolio with Edgetek™ Toughened PPA
To download a high-resolution
To download a high-resolution im
https://www.avient.com/sites/default/files/2023-05/Cesa Stat Product Selector Guide.pdf
Cesa™ Stat temporary antistatic additives
create a conductive network on polymer surfaces
permitting dissipation of the electrical charges.
Permanent
antistatic additives, which function regardless
of the relative humidity by creating an internal
conductive network, are also available as custom
masterbatches.
Permanent antistatic additives
require high loading levels versus temporary
formulations.
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Copyright © 2023, Avient Corporation.
https://www.avient.com/news/broad-portfolio-specialty-wire-and-cable-solutions-avient-exhibiting-wire-2022-trade-fair-d-sseldorf
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ECCOH™ 5702 SEPAP Formulations increase the lifetime of optical fiber cables (OFC) with high chemical and UV resistance.
ECCOH™ 5978 Formulations provide high crush resistance and good UV and chemical performance.
https://www.avient.com/industries/packaging/industrial-packaging/surface-protection
Superior protection and adhesion are essential features of high-performance surface protection films.
Custom HIVIZ recoil pad materials deliver superior recoil reduction and exceptional durability to a high-end rifle manufacturer
Versaflex™ Thermoplastic Elastomers Customized a soft (Shore A) TPE solution that passed strict tests, including thermal deformation (80°C for 2 hours), UV resistance, and assembly resistance
https://www.avient.com/sites/default/files/2022-01/Versaflex CE TPEs for 5G Application Bulletin.pdf
Device designs are changing
to improve high-speed performance and network
connectivity to support faster speeds, higher
capacity, and lower latencies for customers.
Similarly, the cases, accessories, electronic gaskets
and grommets for consumer electronics must also
adapt to minimize signal interference and better
enable high-frequency signal transmission to the
latest devices.
You have the responsibility to conduct full-scale end-product performance testing
to determine suitability in your application, and you assume all risk and liability arising from your use of the information and/or use or handling of any product.