https://www.avient.com/knowledge-base/article/polymer-services-frequency-asked-questions
Material Datasets Available
A number of material characterization data sets are available in .udb, moldex 3D, and SIMPOE format.
How can onsite technical support improve product outcomes?
How can onsite technical support improve product outcomes?
https://www.avient.com/products/engineered-polymer-formulations/conductive-signal-radiation-shielding-formulations/preperm-low-loss-dielectric-thermoplastics
Technical Literature
Marketing + Technical Info
Films, sheet, filaments
https://www.avient.com/news/enhanced-virtual-simulation-capabilities-avient-support-use-polymer-materials-structural-applications
This predictive simulation technology factors in conventional (isotropic) and advanced (anisotropic) modeling data from material characterizations, mold filling analysis, and finite element analysis (FEA).
Especially useful for structural applications, the new global capabilities complement an existing suite of comprehensive design and technical services to improve Avient’s ability to simulate the expected performance of short, long, and continuous fiber composites.
Additionally, designers may access material data and models for a growing number of Avient’s fiber-reinforced solutions using Hexagon’s Digimat™- MX (Material Exchange) software platform.
https://www.avient.com/news/avient-introduces-new-signal-transparent-tpes-enable-high-speed-5g-transmission
This higher frequency range is required for faster data transfer, higher data capacity, and lower latency (i.e., data transmission times).
TECHNICAL NOTE: Both Versaflex CE 3140 TPE grades were formulated to outperform the industry benchmark for phone cases of less than 2.5 Dk at 37 GHz.
https://www.avient.com/industries/packaging/food-packaging/condiments
Corrugated Sheet
Extrusion Sheet & Strap
GLS™ Versaflex™ PF - Technical Bulletin (Chinese)
https://www.avient.com/industries/packaging/food-packaging/shelf-stable-food
Corrugated Sheet
Extrusion Sheet & Strap
GLS™ Versaflex™ PF - Technical Bulletin (Chinese)
https://www.avient.com/knowledge-base/case-study/navigating-challenges-semiconductor-packaging-specialty-polymer-solutions
Increased Demand for Specialty Polymer Solutions and Materials for Semiconductor Packaging
The demand for data center infrastructure has significantly increased with the accelerated adoption of AI-based solutions, cloud computing, and big data analytics.
These technologies rely on semiconductors to process data and provide cloud computing power.
Citations: ¹Fortune Business Insights "Data Center Market Regional Forecast, 2024-2032" https://www.fortunebusinessinsights.com/data-center-market-109851
https://www.avient.com/products/engineered-polymer-formulations/flame-retardant-formulations/maxxam-fr-flame-retardant-formulations-and-maxxam-nhfr-non-halogen-flame-retardant-formulations
Marketing + Technical Info
Technical Literature
Technical information, design guides, processing information and more.
https://www.avient.com/products/polymer-additives/processing-enhancement-additives/cesa-denesting-additives
And unlike silicone and other denesting agents, Cesa Denesting additives don’t require extra steps in the manufacturing process, maintain the transparency of the sheet, and allow for metallization and printing of the packaging.
Marketing + Technical Info
https://www.avient.com/products/thermoplastic-elastomers/resound-bio-thermoplastic-elastomers
Marketing + Technical Info
Technical Literature
Technical information, design guides, processing information and more.
